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Sorter +

CHIP

chipchecker


  • bolt on application for NADA or PST sorters
     
  • inspection option which scans the wafer bevel for cracks and chips
     
  • image capture and KLARF output
     
  • defects down to .05mm
     
  • function can be added to any typical sort recipe

gyro

gyro


  • bolt on application for NADA or PST sorters
     
  • wafer top-side and bottom-side visual inspection
     
  • joystick control or programmable recipe control with pass/fail button
     
  • function can be added to any typical sorting recipe
     
  • automated inspection can be added

gimbal

gimbal


  • bolt on application for NADA or PST sorters
     
  • wafer topside ONLY visual inspection
     
  • joystick control or programmable recipe control with pass/fail button
     
  • function can be added to any typical sorting recipe

scratch

scratch detect


  • using the gyro function
     
  • automated inspection for costly backside scratches
     
  • function can be added to any typical sorting recipe
     
  • image capture and KLARF output

slip

slip


  • addition of slipfinder hardware and software
     
  • wafer slip is detected and measured using propriety Hologenix lighting and software
     
  • typical usage in wafer manufacturing, SOI and EPI
     
  • recipes can scan outer wafer edge, center of wafer, both or entire wafer
     

dimp

dimple


  • addition of dimple hardware and software
     
  • dimples are detected and measured using propriety Hologenix lighting and software
     
  • typical usage in wafer manufacturing and MEMS markets
     
  • whole wafer image processing or magnified version are available
     

thickness

thickness


  • bolt on application for NADA or PST sorters
     
  • wafer thickness measurements
     
  • single center point or radial profiling
     
  • +/- .2um 3 sigma repeatability
     
  • function can be added to any typical sorting recipe
     
  • typical recipes bin wafer based on thickness

noimage2a1

thinwafer


  • capability to handle ultra thin wafer
     
  • vortex style paddles for touch-less operation
     
  • vortex style alignment for touch-less alignment
     
  • as thin as 100um with standard
     
  • as thin as 50um with vortex
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